Manufacturer package reference image
BGA, GREEN, IND TEMP, MRLA
Key Specifications
| Complete manufacturer part number | AT91SAM9G25-CU |
|---|---|
| Manufacturer | Microchip Technology |
| Description | BGA, GREEN, IND TEMP, MRLA |
| Package / case | LFBGA-217 |
| Product category | 32-bit microprocessor |
| Pins | 217 |
| Operating temperature | To be confirmed |
| Manufacturer package type | LFBGA |
| Packing type | TRAY |
| Package size (manufacturer feed; literal value) | 15x15x1.46mm |
| Moisture sensitivity level (manufacturer feed) | MSL-3 |
| Solder composition (manufacturer feed) | SAC105 |
| In stock | 6,974 pcs |
| Unit price | Request a quote |
| Lead time | To be confirmed |
Technical documentation and image source
Available manufacturer parameters matched to the complete ordering code. Historical captures may be used. Parameter verification does not certify product photography or current stock; consult the linked datasheet for conditions.
Manufacturer package reference image for LFBGA-217. Confirm electrical pin functions in the datasheet. Actual lot appearance and top marking require current-lot confirmation.
Some exact-order specifications remain to be confirmed in the manufacturer documentation.
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