Infineon package reference image
The dual SSO8 5x6 mm² package is perfect for single loads. For bridge applications, routing with a dual MOSFET is complex and may require a larger PCB area, with its current ratings limited to 20A. The integrated half-bridge reduces PCB area by providing enhanced routing for bridge applications. It is designed based on optimized OptiMOS™6 technology, offering a wide R<sub>DS(ON)</sub> range from 3.0 mΩ to 7.0 mΩ and an increased current rating of 60A.
Key Specifications
| Complete manufacturer part number | IAUC60N04S6L045HATMA1 |
|---|---|
| Manufacturer | Infineon Technologies |
| Description | The dual SSO8 5x6 mm² package is perfect for single loads. For bridge applications, routing with a dual MOSFET is complex and may require a larger PCB area, with its current ratings limited to 20A. The integrated half-bridge reduces PCB area by providing enhanced routing for bridge applications. It is designed based on optimized OptiMOS™6 technology, offering a wide R<sub>DS(ON)</sub> range from 3.0 mΩ to 7.0 mΩ and an increased current rating of 60A. |
| Package / case | PG-TDSON-8-57 |
| Product category | Automotive MOSFET: 30 V to 800 V |
| Pins | 8 |
| Operating Temperature (manufacturer catalog) | -55 °C to 175 °C |
| Polarity (manufacturer catalog) | N+N |
| QG (manufacturer catalog) | 14 nC |
| Technology (manufacturer catalog) | OptiMOS™6 |
| VGS(th) (manufacturer catalog) | 1.6 V |
| VGS(th) range (manufacturer catalog) | 1.2 to 2 V |
| QG [typ @10V] (manufacturer family record) | 14 nC |
| VGS(th) (manufacturer family record) | 1.6 V |
| VGS(th) minimum (manufacturer family record) | 1.2 V |
| QG maximum [typ @10V] (manufacturer family record) | 19 nC |
| RDS (on) maximum [@10V] (manufacturer family record) | 4.5 mΩ |
| VDS maximum (manufacturer family record) | 40 V |
| VGS(th) maximum (manufacturer family record) | 2 V |
| In stock | Contact for availability |
| Unit price | Request a quote |
| Lead time | To be confirmed |
Technical documentation and image source
Original manufacturer package appearance reference. Eight perimeter contacts and three separate exposed bottom metal regions: elongated right region, upper-left U-shaped region and lower-left rectangular region with isolation channels. Top/bottom original and exact -57 outline agree. These regions are not counted as additional pins and are not reduced to a generic single or double pad. Original public manufacturer appearance reference, not a stock-lot photograph. Only exact full OPNs/full package suffix and physical construction listed are qualified. Metal pads/heatsinks are not extra nominal pins. Top markings, electrical configuration and current-lot appearance are not guaranteed. Every own datasheet literal association verified against unique exact manufacturer catalog OPN row; no all-PDF/electrical revalidation claim. Original appearance bytes/native dimensions retained without crop/resize/enlargement/re-encoding/generation. Mechanical PDF page render is independent read-only evidence, never a primary image candidate. Exact complete OPN, full mechanical suffix, nominal terminals and own frozen datasheet define this association; no electrical interchangeability or unshown-surface inference.
Infineon package reference image for PG-TDSON-8-57. Confirm electrical pin functions in the datasheet. Actual lot appearance and top marking require current-lot confirmation.
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