Manufacturer package outline drawing - not a product photo
Built on the rugged CoolSiC™ G2 technology, the IMDQ75B022M2H integrates two SiC power switches in a dual‑die common‑drain architecture within a top‑side‑cooled Q‑DPAK package, simplifying system design and enabling next‑generation topologies. Designed for modern power grids and energy systems, it delivers high reliability, efficiency, and low lifetime TCO.
Key Specifications
| Complete manufacturer part number | IMDQ75B022M2HXTMA1 |
|---|---|
| Manufacturer | Infineon Technologies |
| Description | Built on the rugged CoolSiC™ G2 technology, the IMDQ75B022M2H integrates two SiC power switches in a dual‑die common‑drain architecture within a top‑side‑cooled Q‑DPAK package, simplifying system design and enabling next‑generation topologies. Designed for modern power grids and energy systems, it delivers high reliability, efficiency, and low lifetime TCO. |
| Package / case | PG-HDSOP-22-4 |
| Product category | Silicon Carbide Bidirectional Switches |
| Pins | 22 |
| Operating Temperature (manufacturer catalog) | -55 °C to 175 °C |
| Polarity (manufacturer catalog) | N |
| RDS (on) (manufacturer catalog) | 22 mΩ |
| Technology (manufacturer catalog) | CoolSiC™ BDS G2 |
| RDS (on) [@ Tj = 25°C] (manufacturer family record) | 22 mΩ |
| VDS maximum (manufacturer family record) | 750 V |
| In stock | Contact for availability |
| Unit price | Request a quote |
| Lead time | To be confirmed |
Technical documentation and image source
Available manufacturer parameters matched to the complete ordering code. Historical captures may be used. Parameter verification does not certify product photography or current stock; consult the linked datasheet for conditions.
Manufacturer package outline drawing - not a product photo for PG-HDSOP-22-4. Confirm electrical pin functions in the datasheet. Actual lot appearance and top marking require current-lot confirmation.
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