Infineon package reference image
CoolSiC™ MOSFET discrete 1200 V, 116 mΩ G2 in a top-side cooled Q-DPAK dual half-bridge package, optimized for industrial applications such as EV charging, string inverters, and power supplies. The Q-DPAK enables lower system cost through simplified assembly and excellent thermal performance. Top-side cooled dual half-bridge design delivers improved cooling, higher energy efficiency, greater design flexibility, and enhanced overall performance.
Key Specifications
| Complete manufacturer part number | IMSQ120R118M2HHXUMA1 |
|---|---|
| Manufacturer | Infineon Technologies |
| Description | CoolSiC™ MOSFET discrete 1200 V, 116 mΩ G2 in a top-side cooled Q-DPAK dual half-bridge package, optimized for industrial applications such as EV charging, string inverters, and power supplies. The Q-DPAK enables lower system cost through simplified assembly and excellent thermal performance. Top-side cooled dual half-bridge design delivers improved cooling, higher energy efficiency, greater design flexibility, and enhanced overall performance. |
| Package / case | PG-HDSOP-16-221 |
| Product category | Silicon carbide MOSFET discretes |
| Pins | 16 |
| Operating Temperature (manufacturer catalog) | -55 °C to 175 °C |
| Ciss (manufacturer catalog) | 500 pF |
| Coss (manufacturer catalog) | 19 pF |
| Encryption (manufacturer catalog) | No |
| Qgd (manufacturer catalog) | 3.6 nC |
| QG (manufacturer catalog) | 15 nC |
| RDS (on) (manufacturer catalog) | 116 mΩ |
| Switch Type (manufacturer catalog) | CoolSiC™ MOSFET |
| Technology (manufacturer catalog) | CoolSiC™ G2 |
| Ciss (manufacturer family record) | 500 pF |
| Coss (manufacturer family record) | 19 pF |
| Pin Count (manufacturer family record) | 16 Pins |
| Qgd (manufacturer family record) | 3.6 nC |
| QG (manufacturer family record) | 15 nC |
| RDS (on) [@ Tj = 25°C] (manufacturer family record) | 116 mΩ |
| RthJA maximum (manufacturer family record) | 62 K/W |
| RthJC maximum (manufacturer family record) | 1.11 K/W |
| VDS maximum (manufacturer family record) | 1200 V |
| In stock | Contact for availability |
| Unit price | Request a quote |
| Lead time | To be confirmed |
Technical documentation and image source
Original manufacturer package appearance reference. Sixteen leads arranged in four groups of four with central gaps in each row. Two separate exposed heatsink regions are divided by a central molded groove; opposite face has four circular recesses. Both surfaces visible in original and match own -221 outline. Two heatsinks do not add nominal pins. Original public manufacturer appearance reference, not a stock-lot photograph. Only exact full OPNs/full package suffix and physical construction listed are qualified. Metal pads/heatsinks are not extra nominal pins. Top markings, electrical configuration and current-lot appearance are not guaranteed. Every own datasheet literal association verified against unique exact manufacturer catalog OPN row; no all-PDF/electrical revalidation claim. Original appearance bytes/native dimensions retained without crop/resize/enlargement/re-encoding/generation. Mechanical PDF page render is independent read-only evidence, never a primary image candidate. Original generic CoolSiC/TOLT/Q-DPAK family text remains unchanged; not a promise of those exact markings for every OPN. Exact complete OPN, full mechanical suffix, nominal terminals and own frozen datasheet define this association; no electrical interchangeability or unshown-surface inference.
Infineon package reference image for PG-HDSOP-16-221. Confirm electrical pin functions in the datasheet. Actual lot appearance and top marking require current-lot confirmation.
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