Infineon package reference image
Hard-switching 600 V, 30 A high speed TRENCHSTOP™ IGBT3 co-packed with Rapid 1 fast and soft anti-parallel diode in a TO-247 advanced isolation package for a best cost efficient solution.
Key Specifications
| Complete manufacturer part number | IKFW40N60DH3EXKSA1 |
|---|---|
| Manufacturer | Infineon Technologies |
| Description | Hard-switching 600 V, 30 A high speed TRENCHSTOP™ IGBT3 co-packed with Rapid 1 fast and soft anti-parallel diode in a TO-247 advanced isolation package for a best cost efficient solution. |
| Package / case | PG-HSIP247-3-1 |
| Product category | IGBT discretes |
| Pins | 3 |
| Operating junction temperature Tvj (manufacturer datasheet) | -40 °C to 175 °C |
| Electrical-characteristics conditions (manufacturer datasheet) | Specified at Tvj = 25 °C, unless otherwise stated. |
| Reliability-margin guidance (manufacturer datasheet) | For optimum lifetime and reliability, the manufacturer recommends operating conditions that do not exceed 80% of the stated maximum ratings. |
| Mounting and isolation-layer handling (manufacturer datasheet) | The manufacturer intends this advanced isolation device to be assembled on an appropriate heatsink. Recommended heatsink flatness is <20 µm per 100 mm and roughness <10 µm. Protect the isolation layer from sharp implements and excessive mechanical impacts or shocks; follow the datasheet handling limits. |
| Encryption (manufacturer catalog) | No |
| RG (manufacturer catalog) | 10 Ω |
| Technology (manufacturer catalog) | IGBT HighSpeed 3 |
| Eoff [Hard Switching] (manufacturer family record) | 0.36 mJ |
| Eon (manufacturer family record) | 0.87 mJ |
| Irrm (manufacturer family record) | 9.9 A |
| QGate (manufacturer family record) | 107 nC |
| Qrr (manufacturer family record) | 0.4 nC |
| RGint (manufacturer family record) | 0 Ω |
| RG (manufacturer family record) | 10 Ω |
| td(off) (manufacturer family record) | 144 ns |
| td(on) (manufacturer family record) | 18 ns |
| tf (manufacturer family record) | 16 ns |
| tr (manufacturer family record) | 34 ns |
| tSC (manufacturer family record) | 5 µs |
| VCE(sat) (manufacturer family record) | 2.3 V |
| VF (manufacturer family record) | 1.6 V |
| In stock | Contact for availability |
| Unit price | Request a quote |
| Lead time | To be confirmed |
Technical documentation and image source
Original manufacturer package appearance reference. Three full straight leads with a central through mounting hole, an annular insulated region around it and a large rear metal area. Two small top recesses. Rear metal is not a fourth terminal; isolation-layer construction is explicitly shown by the exact drawing. Original public manufacturer reference/render, not a current stock-lot photograph or guaranteed top marking. Only exact full OPN, complete mechanical suffix and nominal terminals listed; rear metal/pad is counted only as specified by nominal pins. Only surfaces actually depicted by the original are claimed. Individual dimensions, references, minima/maxima and nominal/general-tolerance values remain distinct. Exact complete OPN, full mechanical suffix, nominal terminals and own frozen datasheet define this association; only original depicted views, no electrical interchangeability or guaranteed marking.
Infineon package reference image for PG-HSIP247-3-1. Confirm electrical pin functions in the datasheet. Actual lot appearance and top marking require current-lot confirmation.
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