Infineon package reference image
High speed 600 V, 75 A hard-switching TRENCHSTOP™ IGBT3 Discrete copacked with anti-parallel diode in a TO-247 advanced isolation package. This package enables the highest power density, the best thermal performance and the lowest cooling effort thanks to an effective and reliable thermal path from the IGBT die to the heatsink.
Key Specifications
| Complete manufacturer part number | IKFW75N60ETXKSA1 |
|---|---|
| Manufacturer | Infineon Technologies |
| Description | High speed 600 V, 75 A hard-switching TRENCHSTOP™ IGBT3 Discrete copacked with anti-parallel diode in a TO-247 advanced isolation package. This package enables the highest power density, the best thermal performance and the lowest cooling effort thanks to an effective and reliable thermal path from the IGBT die to the heatsink. |
| Package / case | PG-HSIP247-3-1 |
| Product category | IGBT discretes |
| Pins | 3 |
| Operating junction temperature Tvj (manufacturer datasheet) | -40 °C to 175 °C |
| Electrical-characteristics conditions (manufacturer datasheet) | Specified at Tvj = 25 °C, unless otherwise stated. |
| Reliability-margin guidance (manufacturer datasheet) | For optimum lifetime and reliability, the manufacturer recommends operating conditions that do not exceed 80% of the stated maximum ratings. |
| Mounting and isolation-layer handling (manufacturer datasheet) | The manufacturer intends this advanced isolation device to be assembled on an appropriate heatsink. Recommended heatsink flatness is <20 µm per 100 mm and roughness <10 µm. Protect the isolation layer from sharp implements and excessive mechanical impacts or shocks; follow the datasheet handling limits. |
| Encryption (manufacturer catalog) | No |
| RG (manufacturer catalog) | 5 Ω |
| Technology (manufacturer catalog) | IGBT TRENCHSTOP™ |
| Eoff [Hard Switching] (manufacturer family record) | 2.35 mJ |
| Eon (manufacturer family record) | 2.7 mJ |
| Irrm (manufacturer family record) | 23 A |
| QGate (manufacturer family record) | 440 nC |
| Qrr (manufacturer family record) | 1.94 nC |
| RGint (manufacturer family record) | 0 Ω |
| RG (manufacturer family record) | 5 Ω |
| td(off) (manufacturer family record) | 340 ns |
| td(on) (manufacturer family record) | 33 ns |
| tf (manufacturer family record) | 35 ns |
| tr (manufacturer family record) | 45 ns |
| tSC (manufacturer family record) | 5 µs |
| VCE(sat) (manufacturer family record) | 1.5 V |
| VF (manufacturer family record) | 1.45 V |
| In stock | Contact for availability |
| Unit price | Request a quote |
| Lead time | To be confirmed |
Technical documentation and image source
Original manufacturer package appearance reference. Three full straight leads with a central through mounting hole, an annular insulated region around it and a large rear metal area. Two small top recesses. Rear metal is not a fourth terminal; isolation-layer construction is explicitly shown by the exact drawing. Original public manufacturer reference/render, not a current stock-lot photograph or guaranteed top marking. Only exact full OPN, complete mechanical suffix and nominal terminals listed; rear metal/pad is counted only as specified by nominal pins. Only surfaces actually depicted by the original are claimed. Individual dimensions, references, minima/maxima and nominal/general-tolerance values remain distinct. Exact complete OPN, full mechanical suffix, nominal terminals and own frozen datasheet define this association; only original depicted views, no electrical interchangeability or guaranteed marking.
Infineon package reference image for PG-HSIP247-3-1. Confirm electrical pin functions in the datasheet. Actual lot appearance and top marking require current-lot confirmation.
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