Manufacturer package reference image
The CoolSiC™ Automotive MOSFET 1200 V in Q-DPAK package is tailored to address OBC/DC-DC applications for 800V Automotive architecture. Leveraging Top-Side-Cooling (TSC) technology, it can provide customers with an outstanding thermal performance, easier assembly and reduced system cost. Compared to back-side cooling, TSC provides an optimized PCB assembly, thus eliminating parasitic effects and providing much lower stray inductances.
Key Specifications
| Complete manufacturer part number | AIMCQ120R120M1TXTMA1 |
|---|---|
| Manufacturer | Infineon Technologies |
| Description | The CoolSiC™ Automotive MOSFET 1200 V in Q-DPAK package is tailored to address OBC/DC-DC applications for 800V Automotive architecture. Leveraging Top-Side-Cooling (TSC) technology, it can provide customers with an outstanding thermal performance, easier assembly and reduced system cost. Compared to back-side cooling, TSC provides an optimized PCB assembly, thus eliminating parasitic effects and providing much lower stray inductances. |
| Package / case | PG-HDSOP-22-3 |
| Product category | Silicon carbide MOSFET discretes |
| Pins | 22 |
| Operating Temperature (manufacturer catalog) | -55 °C to 175 °C |
| RDS (on) [@ Tj = 25°C] (manufacturer family record) | 117 mΩ |
| In stock | Contact for availability |
| Unit price | Request a quote |
| Lead time | To be confirmed |
Technical documentation and image source
Manufacturer source fields matched to the complete ordering code. Historical source captures may be used; this does not confirm current availability. Temperature scope follows the cited record. Package reference image is not a stock-lot photograph. Consult the datasheet for electrical limits and test conditions.
Manufacturer package reference image for PG-HDSOP-22-3. Confirm electrical pin functions in the datasheet. Actual lot appearance and top marking require current-lot confirmation.
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