Infineon package reference image
A high-current, low R<sub>DS(on)</sub> power MOSFET in a 3x3mm² advanced leadless package with a Cu-clip for low package Ron and minimal stray inductance, offering high power density, low conduction losses and optimized switching behavior, with a reduced form factor compared to traditional leaded packages, ideal for Automotive applications, e.g. power distribution, body control modules and electric motors.
Key Specifications
| Complete manufacturer part number | IAUZN04S7L025ATMA1 |
|---|---|
| Manufacturer | Infineon Technologies |
| Description | A high-current, low R<sub>DS(on)</sub> power MOSFET in a 3x3mm² advanced leadless package with a Cu-clip for low package Ron and minimal stray inductance, offering high power density, low conduction losses and optimized switching behavior, with a reduced form factor compared to traditional leaded packages, ideal for Automotive applications, e.g. power distribution, body control modules and electric motors. |
| Package / case | PG-TSDSON-8-44 |
| Product category | Automotive MOSFET: 30 V to 800 V |
| Pins | 8 |
| Operating Temperature (manufacturer catalog) | -55 °C to 175 °C |
| Polarity (manufacturer catalog) | N |
| QG (manufacturer catalog) | 23 nC |
| Technology (manufacturer catalog) | OptiMOS™7 |
| Topology (manufacturer catalog) | OptiMOS™-7 |
| VGS(th) (manufacturer catalog) | 1.5 V |
| VGS(th) range (manufacturer catalog) | 1.2 to 1.8 V |
| QG [typ @10V] (manufacturer family record) | 23 nC |
| VGS(th) (manufacturer family record) | 1.5 V |
| VGS(th) minimum (manufacturer family record) | 1.2 V |
| QG maximum [typ @10V] (manufacturer family record) | 30 nC |
| RDS (on) maximum [@10V] (manufacturer family record) | 2.56 mΩ |
| VDS maximum (manufacturer family record) | 40 V |
| VGS(th) maximum (manufacturer family record) | 1.8 V |
| In stock | Contact for availability |
| Unit price | Request a quote |
| Lead time | To be confirmed |
Technical documentation and image source
Original manufacturer package appearance reference. Eight nominal perimeter terminals. Four drain-side contacts join a large exposed bottom metal region; opposite side has one isolated terminal and a metal region joining three terminals. Top and bottom original visible; pad depth1.71 differs from -32 depth2.11. Pads are not extra pins. Original manufacturer public package appearance rendering, not a stock-lot photograph. Scope limited to the complete OPNs and exact mechanical suffix listed, with actual lead/pad construction and mechanical nominal/tolerance evidence; no unchecked cross-suffix expansion. Top markings, internal electrical functions and present-stock appearance are not guaranteed. Exact own datasheet literal association checked for each unique raw complete OPN; no claim that every full PDF was independently re-read. Original bytes and native dimensions retained; no crop, resize, enlargement, generation or re-encoding. Original carries generic product-family branding/text. Such markings are appearance-reference text, not an asserted marking for every qualified OPN. Complete full ordering code, exact package, nominal terminals, own frozen datasheet and independent mechanical evidence define this image association. No electrical interchangeability or certification is inferred.
Infineon package reference image for PG-TSDSON-8-44. Confirm electrical pin functions in the datasheet. Actual lot appearance and top marking require current-lot confirmation.
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