BGSC2341ML10E6327XTSA1
BGSC2341ML10 is a versatile Integrated Circuit (IC) ideal for RF tuning applications such as tunable impedance matching, antenna tuning and tunable filtering. This IC integrates an 8-states tunable capacitor and an extremely low R<sub>ON</sub> Single Pole Double Throw (SPDT) RF switch function; both controlled by on-chip MIPI 2.1 RFFE digital interface. Unlike some other tunable capacitor technologies, Infineon Bulk CMOS ensures very stable capacitance step values over the entire -40...+85° C temperature range. Last but not the least, BGSC2341ML10 exhibits very good linearity in high RF power conditions and up to RF voltage greater than 39 V which is a key attribute in application like antenna tuning. It does not require any additional High Voltage Supply Controller IC and can be powered by a single 1.8 V power supply at an extremely low current consumption level. With 1.1 mm x 1.5 mm package dimensions, it is a compact solution fitting well to any small form factor mobile phone-like applications.
Key Specifications
| Complete manufacturer part number | BGSC2341ML10E6327XTSA1 |
|---|---|
| Manufacturer | Infineon Technologies |
| Description | BGSC2341ML10 is a versatile Integrated Circuit (IC) ideal for RF tuning applications such as tunable impedance matching, antenna tuning and tunable filtering. This IC integrates an 8-states tunable capacitor and an extremely low R<sub>ON</sub> Single Pole Double Throw (SPDT) RF switch function; both controlled by on-chip MIPI 2.1 RFFE digital interface. Unlike some other tunable capacitor technologies, Infineon Bulk CMOS ensures very stable capacitance step values over the entire -40...+85° C temperature range. Last but not the least, BGSC2341ML10 exhibits very good linearity in high RF power conditions and up to RF voltage greater than 39 V which is a key attribute in application like antenna tuning. It does not require any additional High Voltage Supply Controller IC and can be powered by a single 1.8 V power supply at an extremely low current consumption level. With 1.1 mm x 1.5 mm package dimensions, it is a compact solution fitting well to any small form factor mobile phone-like applications. |
| Package / case | PG-TSLP-10-2 |
| Product category | Semiconductor |
| COFF (manufacturer family record) | 200 fF |
| RON (manufacturer family record) | 0.87 Ω |
| VRFmax (manufacturer family record) | 40 V |
| In stock | Contact for availability |
| Unit price | Request a quote |
| Lead time | To be confirmed |
Technical documentation and image source
The complete ordering code and the fields shown come from the cited manufacturer record. Remaining specifications and product appearance await verification. Listing does not imply current production or stock availability.
Some exact-order specifications remain to be confirmed in the manufacturer documentation.