IDDD10G65C6XTMA1
Manufacturer package reference image
Infineon Technologies introduces Double DPAK (DDPAK), the first top-side cooled surface mount device (SMD) package addressing high power SMPS applications such as PC power, solar, server and telecom. The benefits of the already existing high voltage technology CoolSiC™ Schottky diode 650V G6 is combined with the innovative concept of top-side cooling, providing a system solution for high current hard switching topologies such as PFC and a high-end efficiency solution for LLC topologies.
Key Specifications
| Complete manufacturer part number | IDDD10G65C6XTMA1 |
|---|---|
| Manufacturer | Infineon Technologies |
| Description | Infineon Technologies introduces Double DPAK (DDPAK), the first top-side cooled surface mount device (SMD) package addressing high power SMPS applications such as PC power, solar, server and telecom. The benefits of the already existing high voltage technology CoolSiC™ Schottky diode 650V G6 is combined with the innovative concept of top-side cooling, providing a system solution for high current hard switching topologies such as PFC and a high-end efficiency solution for LLC topologies. |
| Package / case | PG-HDSOP-10-1 |
| Product category | Semiconductor |
| CT (manufacturer family record) | 495 pF |
| IR (manufacturer family record) | 1 µA |
| QC (manufacturer family record) | 14.7 nC |
| RthJC (manufacturer family record) | 0.9 K/W |
| VF (manufacturer family record) | 1.25 V |
| In stock | Contact for availability |
| Unit price | Request a quote |
| Lead time | To be confirmed |
Technical documentation and image source
The complete ordering code and the fields shown come from the cited manufacturer record. Remaining specifications and product appearance await verification. Listing does not imply current production or stock availability.
Manufacturer package reference image for PG-HDSOP-10-1. Confirm electrical pin functions in the datasheet. Actual lot appearance and top marking require current-lot confirmation.
Some exact-order specifications remain to be confirmed in the manufacturer documentation.