IDL06G65C5XUMA2
The CoolSiC™ Schottky diodes generation 5 650 V, 2 A in a DPAK real2pin package represents our leading edge technology for SiC Schottky Barrier diodes. The Infineon proprietary diffusion soldering process, already introduced with G3, is now combined with a new, more compact design and thin wafer technology. The result is a new family of products showing improved efficiency over all load conditions, coming from both the improved thermal characteristics and a lower figure of merit (Q <sub>c</sub> x V <sub>f</sub>).
Key Specifications
| Complete manufacturer part number | IDL06G65C5XUMA2 |
|---|---|
| Manufacturer | Infineon Technologies |
| Description | The CoolSiC™ Schottky diodes generation 5 650 V, 2 A in a DPAK real2pin package represents our leading edge technology for SiC Schottky Barrier diodes. The Infineon proprietary diffusion soldering process, already introduced with G3, is now combined with a new, more compact design and thin wafer technology. The result is a new family of products showing improved efficiency over all load conditions, coming from both the improved thermal characteristics and a lower figure of merit (Q <sub>c</sub> x V <sub>f</sub>). |
| Package / case | PG-VSON-4-1 |
| Product category | Semiconductor |
| Pins | 4 |
| CT (manufacturer family record) | 190 pF |
| IR (manufacturer family record) | 0.3 µA |
| QC (manufacturer family record) | 10 nC |
| RthJC (manufacturer family record) | 1.2 K/W |
| VF (manufacturer family record) | 1.5 V |
| Voltage Class (manufacturer family record) | 650 V |
| V (manufacturer family record) | 650 V |
| In stock | Contact for availability |
| Unit price | Request a quote |
| Lead time | To be confirmed |
Technical documentation and image source
The complete ordering code and the fields shown come from the cited manufacturer record. Remaining specifications and product appearance await verification. Listing does not imply current production or stock availability.
Some exact-order specifications remain to be confirmed in the manufacturer documentation.