IM70A135V01XTMA1
Infineon's XENSIV™ MEMS analog microphone IM70A135 is a compact high-performance microphone with a very high acoustic overload point of 135 dBSPL and a size of only 3.50 x 2.65 x 1.00 mm³. This microphone is based on Infineon's new Sealed Dual Membrane MEMS technology which delivers high ingress protection (IP57) at a microphone level. The small size makes this microphone especially suited for TWS earbud applications.
Key Specifications
| Complete manufacturer part number | IM70A135V01XTMA1 |
|---|---|
| Manufacturer | Infineon Technologies |
| Description | Infineon's XENSIV™ MEMS analog microphone IM70A135 is a compact high-performance microphone with a very high acoustic overload point of 135 dBSPL and a size of only 3.50 x 2.65 x 1.00 mm³. This microphone is based on Infineon's new Sealed Dual Membrane MEMS technology which delivers high ingress protection (IP57) at a microphone level. The small size makes this microphone especially suited for TWS earbud applications. |
| Package / case | PG-TLGA-5-5 |
| Product category | Semiconductor |
| AOP (manufacturer family record) | 135 dBSPL |
| Current Consumption (manufacturer family record) | 170 µA |
| LFRO (manufacturer family record) | 37 Hz |
| Sensitivity (manufacturer family record) | -38 dBV |
| SNR (manufacturer family record) | 70 dB(A) |
| In stock | Contact for availability |
| Unit price | Request a quote |
| Lead time | To be confirmed |
Technical documentation and image source
The complete ordering code and the fields shown come from the cited manufacturer record. Remaining specifications and product appearance await verification. Listing does not imply current production or stock availability.
Some exact-order specifications remain to be confirmed in the manufacturer documentation.