IMDQ75B050M2HXTMA1
Built on rugged CoolSiC™ G2 technology, the IMDQ75B050M2H integrates two SiC power switches in a dual‑die common‑drain architecture within a top‑side‑cooled Q‑DPAK package, simplifying system design and enabling next‑generation topologies. Designed for modern power grids and energy systems, it delivers high reliability, efficiency, and low lifetime TCO.
Key Specifications
| Complete manufacturer part number | IMDQ75B050M2HXTMA1 |
|---|---|
| Manufacturer | Infineon Technologies |
| Description | Built on rugged CoolSiC™ G2 technology, the IMDQ75B050M2H integrates two SiC power switches in a dual‑die common‑drain architecture within a top‑side‑cooled Q‑DPAK package, simplifying system design and enabling next‑generation topologies. Designed for modern power grids and energy systems, it delivers high reliability, efficiency, and low lifetime TCO. |
| Package / case | PG-HDSOP-22-6 |
| Product category | Semiconductor |
| RDS (on) [@ Tj = 25°C] (manufacturer family record) | 50 mΩ |
| VDS maximum (manufacturer family record) | 750 V |
| In stock | Contact for availability |
| Unit price | Request a quote |
| Lead time | To be confirmed |
Technical documentation and image source
The complete ordering code and the fields shown come from the cited manufacturer record. Remaining specifications and product appearance await verification. Listing does not imply current production or stock availability.
Some exact-order specifications remain to be confirmed in the manufacturer documentation.