S25FL256SDSBHB213
Manufacturer package reference image
The S25FL256SDSBHB213 is a 256 Mb (32 MB) automotive-grade SPI flash memory featuring 65-nm MIRRORBIT™ technology and Eclipse architecture for improved program and erase performance. It supports SPI Multi-I/O with single, dual, quad, and DDR modes, delivering up to 80 MBps read rates (Quad DDR, 80 MHz). Operating from 2.7 V to 3.6 V core and 1.65 V to 3.6 V I/O, it meets AEC-Q100 Grade 2 (-40°C to +105°C) requirements.
Key Specifications
| Complete manufacturer part number | S25FL256SDSBHB213 |
|---|---|
| Manufacturer | Infineon Technologies |
| Description | The S25FL256SDSBHB213 is a 256 Mb (32 MB) automotive-grade SPI flash memory featuring 65-nm MIRRORBIT™ technology and Eclipse architecture for improved program and erase performance. It supports SPI Multi-I/O with single, dual, quad, and DDR modes, delivering up to 80 MBps read rates (Quad DDR, 80 MHz). Operating from 2.7 V to 3.6 V core and 1.65 V to 3.6 V I/O, it meets AEC-Q100 Grade 2 (-40°C to +105°C) requirements. |
| Package / case | PG-TFBGA-24-800 |
| Product category | Memory ICs |
| Pins | 24 |
| Density (manufacturer family record) | 256 MBit |
| Interface Bandwidth (manufacturer family record) | 80 MByte/s |
| Operating Voltage (manufacturer family record) | 3 V |
| Peak Reflow Temp (manufacturer family record) | 260 °C |
| In stock | 10,014 pcs |
| Unit price | Request a quote |
| Lead time | To be confirmed |
Technical documentation and image source
Manufacturer source fields matched to the complete ordering code. Historical source captures may be used; this does not confirm current availability. Temperature scope follows the cited record. Package reference image is not a stock-lot photograph. Consult the datasheet for electrical limits and test conditions.
Manufacturer package reference image for PG-TFBGA-24-800. Confirm electrical pin functions in the datasheet. Actual lot appearance and top marking require current-lot confirmation.
Some exact-order specifications remain to be confirmed in the manufacturer documentation.