Infineon package reference image
This OptiMOS™ 5 MOSFET in TOLT (TO-Leaded top side-cooling) package, combines package innovation with OptiMOS™ 5 technology for best-in-class products in 80 V as well as high current rating for high power density designs. With top side-cooling the drain is exposed at the surface of the package and 95 percent of the heat dissipation can be promoted directly to the heatsink achieving better thermal performance compared to TOLL package.
Key Specifications
| Complete manufacturer part number | IPTC012N08NM5ATMA1 |
|---|---|
| Manufacturer | Infineon Technologies |
| Description | This OptiMOS™ 5 MOSFET in TOLT (TO-Leaded top side-cooling) package, combines package innovation with OptiMOS™ 5 technology for best-in-class products in 80 V as well as high current rating for high power density designs. With top side-cooling the drain is exposed at the surface of the package and 95 percent of the heat dissipation can be promoted directly to the heatsink achieving better thermal performance compared to TOLL package. |
| Package / case | PG-HDSOP-16-2 |
| Product category | N-channel MOSFETs |
| Pins | 16 |
| Operating Temperature (manufacturer catalog) | -55 °C to 175 °C |
| Polarity (manufacturer catalog) | N |
| QG (manufacturer catalog) | 175 nC |
| Switch Type (manufacturer catalog) | MOSFET |
| Technology (manufacturer catalog) | OptiMOS™ 5 |
| VGS(th) (manufacturer catalog) | 3 V |
| VGS(th) range (manufacturer catalog) | 2.2 to 3.8 V |
| Pin Count (manufacturer family record) | 16 Pins |
| QG [typ @10V] (manufacturer family record) | 175 nC |
| VGS(th) (manufacturer family record) | 3 V |
| VGS(th) minimum (manufacturer family record) | 2.2 V |
| RDS (on) maximum [@10V] (manufacturer family record) | 1.2 mΩ |
| VDS maximum (manufacturer family record) | 80 V |
| VGS(th) maximum (manufacturer family record) | 3.8 V |
| In stock | Contact for availability |
| Unit price | Request a quote |
| Lead time | To be confirmed |
Technical documentation and image source
Original manufacturer package appearance reference. Sixteen formed leads, eight each side, with a single exposed top heatsink and molded bottom surface. Original single top-oblique view matches top heatsink perimeter and lead rows; bottom construction comes from exact outline, not visible in original. Top metal is not a17th lead. Original public manufacturer appearance reference, not a stock-lot photograph. Only exact full OPNs/full package suffix and physical construction listed are qualified. Metal pads/heatsinks are not extra nominal pins. Top markings, electrical configuration and current-lot appearance are not guaranteed. Every own datasheet literal association verified against unique exact manufacturer catalog OPN row; no all-PDF/electrical revalidation claim. Original appearance bytes/native dimensions retained without crop/resize/enlargement/re-encoding/generation. Mechanical PDF page render is independent read-only evidence, never a primary image candidate. Original appearance is top-only; bottom molded surface is established by exact mechanical outline, not depicted in the original appearance. Exact complete OPN, full mechanical suffix, nominal terminals and own frozen datasheet define this association; no electrical interchangeability or unshown-surface inference.
Infineon package reference image for PG-HDSOP-16-2. Confirm electrical pin functions in the datasheet. Actual lot appearance and top marking require current-lot confirmation.
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