24AA256T-I/CS16K
Manufacturer package reference image
2K, 256 X 8 1.8V SERIAL DIE IN WAFER LEVEL CHIP SCALE PKG.
Key Specifications
| Complete manufacturer part number | 24AA256T-I/CS16K |
|---|---|
| Manufacturer | Microchip Technology |
| Description | 2K, 256 X 8 1.8V SERIAL DIE IN WAFER LEVEL CHIP SCALE PKG. |
| Package / case | CSP-8 |
| Product category | Component specifications |
| Pins | 8 |
| Temperature range (datasheet ordering guide) | -40 °C to 85 °C |
| Manufacturer package type | CSP |
| Packing type | COBT/R |
| Package size (manufacturer feed; literal value) | Varies |
| Moisture sensitivity level (manufacturer feed) | MSL-1 |
| Solder composition (manufacturer feed) | SAC |
| In stock | 3,693 pcs |
| Unit price | Request a quote |
| Lead time | To be confirmed |
Technical documentation and image source
Available manufacturer parameters matched to the complete ordering code. Historical captures may be used. Parameter verification does not certify product photography or current stock; consult the linked datasheet for conditions.
Manufacturer package reference image for CSP-8. Confirm electrical pin functions in the datasheet. Actual lot appearance and top marking require current-lot confirmation.
Some exact-order specifications remain to be confirmed in the manufacturer documentation.