ATSAMA5D24B-CU
Manufacturer package reference image
BGA GREEN, IND TEMP,MRLB
Key Specifications
| Complete manufacturer part number | ATSAMA5D24B-CU |
|---|---|
| Manufacturer | Microchip Technology |
| Description | BGA GREEN, IND TEMP,MRLB |
| Package / case | TFBGA-256 |
| Product category | Microprocessors |
| Pins | 256 |
| Manufacturer package type | TFBGA |
| Packing type | TRAY |
| Package size (manufacturer feed; literal value) | 8x8x1.05mm |
| Moisture sensitivity level (manufacturer feed) | MSL-3 |
| Solder composition (manufacturer feed) | LF35 |
| In stock | 8,639 pcs |
| Unit price | Request a quote |
| Lead time | To be confirmed |
Technical documentation and image source
Available manufacturer parameters matched to the complete ordering code. Historical captures may be used. Parameter verification does not certify product photography or current stock; consult the linked datasheet for conditions.
Manufacturer package reference image for TFBGA-256. Confirm electrical pin functions in the datasheet. Actual lot appearance and top marking require current-lot confirmation.
Some exact-order specifications remain to be confirmed in the manufacturer documentation.