ATSAMA5D29-TA100-CN
Manufacturer package reference image
SAMA5D29 TA100 SIP,BGA,EXT TEMP
Key Specifications
| Complete manufacturer part number | ATSAMA5D29-TA100-CN |
|---|---|
| Manufacturer | Microchip Technology |
| Description | SAMA5D29 TA100 SIP,BGA,EXT TEMP |
| Package / case | TFBGA-324 |
| Product category | Microprocessors |
| Pins | 324 |
| Manufacturer package type | TFBGA |
| Packing type | TRAY |
| Package size (manufacturer feed; literal value) | 15x15x1.2 |
| Moisture sensitivity level (manufacturer feed) | MSL-3 |
| Solder composition (manufacturer feed) | SAC105 |
| In stock | 3,783 pcs |
| Unit price | Request a quote |
| Lead time | To be confirmed |
Technical documentation and image source
Available manufacturer parameters matched to the complete ordering code. Historical captures may be used. Parameter verification does not certify product photography or current stock; consult the linked datasheet for conditions.
Manufacturer package reference image for TFBGA-324. Confirm electrical pin functions in the datasheet. Actual lot appearance and top marking require current-lot confirmation.
Some exact-order specifications remain to be confirmed in the manufacturer documentation.