MIC33M350YMP-TRVAO

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MIC33M350YMP-TRVAO — Manufacturer package reference image, QFN-24
Manufacturer package reference image

5.5V 3A ultra-small, pin-strapping/I2C-Configurable Power Module (Sip)

Key Specifications

Complete manufacturer part numberMIC33M350YMP-TRVAO
ManufacturerMicrochip Technology
Description5.5V 3A ultra-small, pin-strapping/I2C-Configurable Power Module (Sip)
Package / caseQFN-24
Product categoryComponent specifications
Pins24
Manufacturer package typeQFN
Packing typeT/R
Package size (manufacturer feed; literal value)4.5x3x1.9mm
Moisture sensitivity level (manufacturer feed)MSL-2
Solder composition (manufacturer feed)Not Applicable
In stock8,584 pcs
Unit priceRequest a quote
Lead timeTo be confirmed

Technical documentation and image source

Available manufacturer parameters matched to the complete ordering code. Historical captures may be used. Parameter verification does not certify product photography or current stock; consult the linked datasheet for conditions.

Manufacturer package reference image for QFN-24. Confirm electrical pin functions in the datasheet. Actual lot appearance and top marking require current-lot confirmation.

Some exact-order specifications remain to be confirmed in the manufacturer documentation.

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Part Number: MIC33M350YMP-TRVAO
Manufacturer: Microchip Technology
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