PIC32CX1025SG60100-E/HJB
Manufacturer package reference image
SIP TA100 + CM4, BGA 100, 1 MFlash, USB, Eth., CAN, E Temp, Tray
Key Specifications
| Complete manufacturer part number | PIC32CX1025SG60100-E/HJB |
|---|---|
| Manufacturer | Microchip Technology |
| Description | SIP TA100 + CM4, BGA 100, 1 MFlash, USB, Eth., CAN, E Temp, Tray |
| Package / case | TFBGA-100 |
| Product category | 32-bit Microcontrollers - MCU |
| Pins | 100 |
| Operating temperature | To be confirmed |
| Manufacturer package type | TFBGA |
| Packing type | TRAY |
| Package size (manufacturer feed; literal value) | 9x9x1.2mm |
| Moisture sensitivity level (manufacturer feed) | MSL-3 |
| Solder composition (manufacturer feed) | Sn96.5/Ag3.5 |
| In stock | 4,578 pcs |
| Unit price | Request a quote |
| Lead time | To be confirmed |
Technical documentation and image source
Available manufacturer parameters matched to the complete ordering code. Historical captures may be used. Parameter verification does not certify product photography or current stock; consult the linked datasheet for conditions.
Manufacturer package reference image for TFBGA-100. Confirm electrical pin functions in the datasheet. Actual lot appearance and top marking require current-lot confirmation.
Some exact-order specifications remain to be confirmed in the manufacturer documentation.