ZL30312GKG2
Manufacturer package reference image
IEEE1588 ToP and SyncE device
Key Specifications
| Complete manufacturer part number | ZL30312GKG2 |
|---|---|
| Manufacturer | Microchip Technology |
| Description | IEEE1588 ToP and SyncE device |
| Package / case | HBGA-256 |
| Product category | Component specifications |
| Pins | 256 |
| Operating temperature | To be confirmed |
| Manufacturer package type | HBGA |
| Packing type | TRAY |
| Package size (manufacturer feed; literal value) | 17x17x1.97mm |
| Moisture sensitivity level (manufacturer feed) | MSL-3 |
| Solder composition (manufacturer feed) | SAC305 |
| In stock | 12,547 pcs |
| Unit price | Request a quote |
| Lead time | To be confirmed |
Technical documentation and image source
Available manufacturer parameters matched to the complete ordering code. Historical captures may be used. Parameter verification does not certify product photography or current stock; consult the linked datasheet for conditions.
Manufacturer package reference image for HBGA-256. Confirm electrical pin functions in the datasheet. Actual lot appearance and top marking require current-lot confirmation.
Some exact-order specifications remain to be confirmed in the manufacturer documentation.