MSPM0G3519SPNR
Order the MSPM0G3519SPNR - 80 MHz ARM® Cortex®-M0+ MCU with dual-bank 512kB flash, 128kB SRAM, 2xCAN-FD, 2xADC, DAC, COMP | PN | 80 | -40 to 125 from Texas Instruments.
Key Specifications
| Complete manufacturer part number | MSPM0G3519SPNR |
|---|---|
| Manufacturer | Texas Instruments |
| Description | Order the MSPM0G3519SPNR - 80 MHz ARM® Cortex®-M0+ MCU with dual-bank 512kB flash, 128kB SRAM, 2xCAN-FD, 2xADC, DAC, COMP | PN | 80 | -40 to 125 from Texas Instruments. |
| Package / case | LQFP (PN) |
| Product category | Electronic component |
| Pins | 80 |
| Operating temperature (exact ordering record) | -40 to 125 °C |
| Standard quantity / packing | 1,000 | LARGE T&R |
| CPU | Arm Cortex-M0+ |
| Frequency (MHz) | 80 |
| Flash memory (kByte) | 512 |
| RAM (kByte) | 128 |
| ADC type | 12-bit SAR |
| Features | 5-V-tolerant I/Os, AES encryption, CAN FD, Comparator, DAC, DMA, MATHACL, RTC |
| UART | 5, 6, 7 |
| CAN (#) | CAN-FD |
| Security | Cryptographic acceleration, Hardware-enforced isolation, Secure boot, Secure communication, Secure debug, Secure firmware & software update, Secure storage, Software IP protection |
| TI functional safety category | Functional Safety-Compliant |
| Number of ADC channels | 16, 20, 21, 27 |
| SPI | 2, 3 |
| Hardware accelerators | Trigonometric math accelerator |
| Edge AI enabled | Yes |
| Rating | Catalog |
| Communication interface | CAN-FD, I2C, LIN, SPI, UART |
| Operating system | AutoSAR, BareMetal (No OS), FreeRTOS, Zephyr RTOS |
| Nonvolatile memory (kByte) | 512 |
| Number of GPIOs | 28, 38, 42, 44, 60, 74, 94 |
| Number of I2Cs | 3 |
| In stock | Contact for availability |
| Unit price | Request a quote |
| Lead time | To be confirmed |
Technical documentation and image source
The complete ordering code and the fields shown come from the cited manufacturer record. Remaining specifications and product appearance await verification. Listing does not imply current production or stock availability.
Some exact-order specifications remain to be confirmed in the manufacturer documentation.